Management of heat generation, flow and loss is often a critical factor in high performance systems.
The life of semiconductor and other devices is strongly dependent on
the peak temperatures experienced during operation. Other unwanted side
effects include differential expansion causing misalignment and high
levels of stress. For example, for a 50C temperature change, the
mismatch between aluminium and steel over a length of 300mm is around
0.2mm.
Other systems
may require management of temperature and heat flow as an integral part
of their function. We have the experience and skills necessary to
integrate thermal design with other disciplines, providing an effective
overall solution. Home
